- Silent Efficiency: Say goodbye to noisy distractions and welcome the serene tranquility of the CNPS 80G Rev 3. Equipped with advanced fan technology and optimized airflow design, this CPU cooler operates at an ultra-quiet noise level without compromising on cooling efficiency. It ensures a peaceful computing experience, allowing you to focus on what truly matters.
- Universal Compatibility: Designed to cater to the needs of both Intel and AMD users, the CNPS 80G Rev 3 guarantees hassle-free installation on a wide range of modern processors. Supports Intel LGA1700/1200/115X, and AMD AM5 / AM4
- Flower Heatsink Fin Design: Unleash the full potential of your CPU with Zalman's innovative flower heatsink fin design. By utilizing this unique arrangement of cooling fins, the CNPS 80G Rev 3 maximizes surface area and enhances heat dissipation, effectively lowering temperatures and maintaining optimal performance even under heavy workloads.
- Compact and Space-Saving: Tired of bulky CPU coolers taking up precious space in your PC build? The CNPS 80G Rev 3 understands your concerns. Its compact size ensures a perfect fit even in limited-space setups, making it an ideal choice for mini-ITX and micro-ATX configurations.
- Performance and Reliability: Rest assured that Zalman's expertise in cooling technology has been poured into the CNPS 80G Rev 3. Built with high-quality materials and rigorously tested, this CPU cooler is engineered to deliver consistent performance and reliability, keeping your CPU safe and sound for extended periods.
Low Profile CPU Cooler
The heat radiation surface has been expanded 1.5x larger when compared with similar coolers. The wider heat dissipation area absorbs heat generated by the CPU and evenly distributes the heat throughout, making it possible to achieve 60W TDP in a compact size.
Top-Down Blowing
1.5x heat radiation area compared to other same volume coolers. Top-Down Blowing design cools not only the CPU but also the other components around the CPU.
Optimized Cooling Solution
Improving Performance with Ultra-Quiet 85mm PWM Fan.
Heat Element
Heat Element (A): Heat transfer path of common heat sink. Heat Element (B): Heat Transfer path of FHS (Flower Heat Sink). FHS provides a simple heat transfer path and larger heat dissipation area.
Flower Heatsink (FHS) Fin Design for Optimized Performance
It features a wide heat dissipation structure compared to other compression-type heatsinks, and the heat generated from the CPU is evenly distributed throughout the heatsink, which made it possible to achieve 65W TDP in a compact size.