The falcon utilizes its powerful wings to soar through the skies and lock down its prey. The AORUS Core takes inspiration from the falcon's aerodynamic wings, incorporating a multi-layered design which features wing shaped contours and also resembles the falcon's high velocity ascension and dive through the skies. With sleek and metallic armor, the AORUS Core symbolizes advancement in technology with its futuristic style.
X299 AORUS MASTER motherboard uses an 12 phase digital CPU power design which includes both digital PWM Controller. These 100% digital controller and additional 8+8 Solid-pin CPU Power Connectors offer incredible precision in delivering power to the motherboard's most power-hungry and energy-sensitive components, allowing enthusiasts to get the absolute maximum performance from the new 9th Generation Intel Core processors.
GIGABYTE's exclusive 2X Copper PCBs design provides sufficient power trace paths between components to handle greater than normal power loads and to remove heat from the critical CPU power delivery area. This is essential to ensure the motherboard is able to handle the increased power loading that is necessary when overclocking.
X299 AORUS MASTER uses Fins-Array Heatsink which increases the heat dissipation area by 300% compared to traditional heatsinks of the same size. By using LAIRD 1.5mm thick, 5W/mK high thermal conductivity pad, it can transfer 2.7x more heat than traditional thermal pads in the same time period. 6mm Heatpipe helps to transfer heat between two heatsinks which improves overall thermal balance of the MOSFETs.
Increase 300% heat dissipation area compared to traditional heatsink in same size.
Built-in active cooling fan for faster MOSFET Heat dissipation; automatically adjust fan speed base on VRM temp.
Heatpipe helps to transfer heat between two heatsinks which improves overall thermal balance of the MOSFETs.
By using 1.5mm thicker 5 W/mK thermal conductivity pad, it can transfer 2.7x more heat than usual thermal pad in the same time.
By using thermal pads between PCB back side components and baseplate to transfer heat and dissipate it by large metal plate.